Transmission channel for ultrasound applications

ABSTRACT

A transmission channel transmits high-voltage pulses and receives echos of the high-voltage pulses. The transmission channel includes a current generator circuit, which generates current-integrator drive currents, a receiver, which amplifies transducer-echo signals, and control circuitry. The control circuitry generates one or more control signals to control generation of current-integrator drive currents by the current generator circuit during transducer-driving periods and reception of transducer-echo signals by the receiver during echo-reception periods. A current integrator integrates current-integrator drive currents generated by current generator circuit to generate transducer drive signals.

BACKGROUND

1. Technical Field

The present disclosure relates to transmission channels, such astransmission channels for ultrasound applications.

2. Description of the Related Art

Sonography or ultrasonography is a system of medical diagnostic testingthat uses ultrasonic waves or ultrasounds and is based on the principleof the transmission of the ultrasounds and of the emission of echo andis widely used in the internistic, surgical and radiological fields.

The ultrasounds normally used are, for example, between 1 and 20 MHz infrequency. The frequency is chosen by taking into consideration thathigher frequencies have a greater image resolving power, but penetrateless in depth in the subject under examination.

These ultrasounds may typically be generated by a piezoceramic crystalinserted in a probe maintained in direct contact with the skin of thesubject with the interposition of a suitable gel (being suitable foreliminating the air between probe and subject's skin, allowing theultrasounds to penetrate in the anatomic segment under examination). Thesame probe is typically able to collect a return signal or echo, whichmay be suitably processed by a computer and displayed on a monitor.

The ultrasounds that reach a variation point of the acoustic impedance,and thus for example an internal organ, are partially reflected and thereflected percentage conveys information about the impedance differencebetween the crossed tissues. It is to be noted that, the big impedancedifference between a bone and a tissue being considered, with thesonography it is generally not possible to see behind a bone, whichcauses a total reflection of the ultrasounds, while air or gas zonesgive “shade”, causing a partial reflection of the ultrasounds.

The time employed by an ultrasonic wave for carrying out the path ofgoing, reflection and return is provided to the computer, whichcalculates the depth wherefrom the echo has come, thus identifying thedivision surface between the crossed tissues (corresponding to thevariation point of the acoustic impedance and thus to the depthwherefrom the echo comes).

Substantially, an ultrasonographer, in particular a diagnostic apparatusbased on the ultrasound sonography, may essentially comprise threeparts:

-   -   a probe comprising at least one transducer, for example of the        ultrasonic type, which transmits and receives an ultrasound        signal;    -   an electronic system that drives the transducer for the        generation of the ultrasound signal or pulse to be transmitted        and receives an echo signal of return at the probe of this        pulse, processing in consequence the received echo signal; and    -   a displaying system of a corresponding sonography image        processed based on the echo signal received by the probe.

The word transducer generally indicates an electric or electronic devicethat converts a type of energy relative to mechanical and physicalquantities into electric signals. In a broad sense, a transducer issometimes defined as any device that converts energy from one form toanother, so that this latter can be re-processed, for example by men orby other machines. Many transducers are both sensors and actuators. Anultrasonic transducer usually comprises a piezoelectric crystal that issuitably biased for causing its deformation and the generation of theultrasound signal or pulse.

A typical transmission channel or TX channel being used in theseapplications is schematically shown in FIG. 1. It allows to reach 5levels output. The transmission channel 1 comprises an input logic 2that drives, in correspondence with an input bus BUS_(IN), a levelshifter 3, in turn connected to a high voltage buffer block 4. The highvoltage buffer block 4 is electrically coupled between pairs of highvoltage reference terminals, respectively higher voltage referenceterminals HVP0 and HVP1 and lower voltage reference terminals HVM0 andHVM1, and has a pair of input terminals, INB1 and INB2, connected to thelevel shifter 3, as well as a pair of output terminals, OUTB1 and OUTB2,connected to a corresponding pair of input terminals, INC1 and INC2 of aclamping block 5.

Furthermore, the clamping block 5 is connected to a clamp voltagereference terminal PGND and has an output terminal corresponding to afirst output terminal HVout of the transmission channel 1, in turnconnected, through an anti-noise block 6, to a connection terminal Xdcrfor the transducer to be driven through the transmission channel 1.

A high voltage switch 7 is electrically coupled between the connectionterminal Xdcr and a second output terminal LVout of the transmissionchannel 1. This high voltage switch 7 is able to transmit an outputsignal being at the output of the anti-noise block 6 to the secondoutput terminal LVout during the receiving step of the transmissionchannel 1.

It is to be noted that the switch 7 is a high voltage one since, duringthe transmission step of the transmission channel 1, a signal being onthe connection terminal Xdcr is a high voltage signal although theswitch 7 is off. When this switch 7 is instead on, e.g., during thereception step of the transmission channel 1, the signal Xdcr isgenerally at a voltage value next to zero since the piezoelectrictransducer connected to the transmission channel 1 is sensing smallreturn echoes of ultrasound pulse signals, as shown in FIG. 2.

Typically, an ultrasonic transducer transmits a high voltage pulse ofthe duration of tens of ns, and listens for reception of the echo ofthis pulse, generated by the reflection on the organs of a subject underexamination, for the duration of hundreds of μs, to go back to thetransmission of a new high voltage pulse.

For example, a first pulse IM1 and a second pulse IM2 are transmittedwith a peak to peak excursion equal, in the example shown, to 190Vppwith reception by the transducer of corresponding echoes shown in FIG. 2and indicated with E1 and E2.

The high voltage switch 7 is shown in greater detail in FIG. 3A, whileits equivalent circuit according to working conditions (ON) is shown inFIG. 3B.

The high voltage switch 7 comprises a first switching transistor MS1 anda second switching transistor MS2, being electrically coupled, in seriesto each other, between the connection terminal Xdcr and the secondoutput terminal LVout of the transmission channel 1 and havingrespective control or gate terminals connected, at the turning-on of theswitch 7 itself, to a first and to a second supply voltage referenceterminals, VDD_M and VDD_P respectively. FIG. 3A also shows theequivalent diodes, DS1 and DS2, of the switching transistors, MS1 andMS2, as well as their gate-source capacitances, Cg1 and Cg2respectively.

The first capacitance Cg1 of the first switching transistor MS1 isconnected between the corresponding gate terminal, in turn connected tothe first supply voltage reference terminal VDD_M and a first switchingnode XS1, corresponding to a source terminal of the first switchingtransistor MS1. Similarly, the second capacitance Cg2 of the secondswitching transistor MS2 is connected between the relative gateterminal, in turn connected to the second supply voltage referenceterminal VDD_P and a second switching node XS2, corresponding to asource terminal of the second switching transistor MS2.

As shown in the equivalent circuit of FIG. 3B, when the high voltageswitch 7 is on and thus the gate terminals of the switching transistorsMS1 and MS2 are connected to the first VDD_M and to the second supplyvoltage reference terminal VDD_P as indicated in FIG. 3A (which in FIG.3B, for sake of simplicity, have been shown as a single referencevoltage, for example, ground, being these first and second supplyvoltage references), these switching transistors behave as respectiveresistances R1 and R2, that are electrically coupled between theconnection terminal Xdcr and the second output terminal LVout of thetransmission channel 1 (the second output terminal LVout coinciding withthe second switching node XS2) and interconnected in correspondence withthe first switching node XS1.

According to these conditions, the first capacitance Cg1 is connectedbetween the first connection node XS1 and the first supply voltagereference VDD_M, while the second capacitance Cg2 is connected betweenthe second connection node XS2 and the second supply voltage referenceVDD_P. The first and second supply voltage references are fixedsupplies, and are shown for sake of simplicity in FIG. 3B as a singlereference voltage, the ground GND. This parallel capacitance introducesa strong mitigation of the signal at the input of the high voltageswitch 7, e.g., of the signal at the output of the transmission channel1 after the anti-noise block 6.

In general, the switch 7 should be a high voltage switch so as not tobreak during transmission of high-voltage driving pulses to the load.

Further, the high voltage buffer block 4 comprises a first branchcomprising a first buffer transistor MB1 and a first buffer diode DB1,being electrically coupled, in series to each other, between a firsthigher voltage reference terminal HVP0 and a buffer central node XBc, aswell as a second buffer diode DB2 and a second buffer transistor MB2,electrically coupled, in series to each other, between the buffercentral node XBc and a first lower voltage reference terminal HVM0. Thefirst and second buffer transistors, MB1 and MB2, have respectivecontrol or gate terminals in correspondence with a first XB1 and with asecond inner circuit node XB2 of the high voltage buffer block 4 andconnected to, and driven by, a first DRB1 and a second buffer inputdriver DRB2, in turn connected to the level shifter 3 in correspondencewith the first and second input terminals, INB1 and INB2, of the highvoltage buffer block 4.

The high voltage buffer block 4 also comprises, in parallel to the firstbranch, a second branch in turn comprising a third buffer transistor MB3and a third buffer diode DB3, being electrically coupled, in series toeach other, between a second higher voltage reference terminal HVP1 andthe buffer central node XBc, as well as a fourth buffer diode DB4 and afourth buffer transistor MB4, electrically coupled, in series to eachother, between the buffer central node XBc and a second lower voltagereference terminal HVM1. The third and fourth buffer transistors, MB3and MB4, have respective control or gate terminals in correspondencewith a third XB3 and a fourth inner circuit node XB4 of the high voltagebuffer block 4 and connected to, and driven by, a third DRB3 and afourth buffer input driver DRB4, in turn connected to the first XB1 andto the second inner circuit node XB2 and then to the first DRB1 and tothe second buffer input driver DRB2, respectively, as well as to a firstOUTB1 and to a second output terminal OUTB2.

In the example of the figure, the first and third buffer transistors,MB1 and MB3, are high voltage P-channel MOS transistors (HV Pmos) whilethe second and fourth buffer transistors, MB2 and MB4, are high voltageN-channel MOS transistors (HV Nmos). Moreover, the buffer diodes, DB1,DB2, DB3 and DB4, are high voltage diodes (HV diode).

The clamping block 5 has in turn a first INC1 and a second inputterminal INC2, respectively connected to the first OUTB1 and secondoutput terminal OUTB2 of the high voltage buffer block 4.

The clamping block 5 comprises a first clamp driver DRC1 connectedbetween the first input terminal INC1 and a control or gate terminal ofa first clamp transistor MC1, in turn electrically coupled, in serieswith a first clamp diode DC1, between the clamp voltage referenceterminal PGND, for example a ground, and a clamp central node XCc. Thefirst clamp transistor MC1 and the first clamp diode DC1 areinterconnected in correspondence with a first clamp circuit node XC1.

The clamping block 5 also comprises a second clamp driver DRC2 connectedbetween the second input terminal INC2 and a control or gate terminal ofa second clamp transistor MC2, in turn electrically coupled, in serieswith a second clamp diode DC2, between the clamp central node XCc andthe clamp voltage reference terminal PGND. The second clamp transistorMC2 and the second clamp diode DC2 are interconnected in correspondencewith a second clamp circuit node XC2.

The clamp central node XCc is also connected to the first outputterminal HVout of the transmission channel 1, in turn connected to theconnection terminal Xdcr through an anti-noise block 6 comprisingrespective first and second anti-noise diodes, DN1 and DN2, connected inantiparallel, e.g., by having the anode terminal of the first diodeconnected to the cathode terminal of the second diode and vice versa,between the first output terminal HVout and the connection terminalXdcr.

In the example of FIG. 1, the first clamp transistor MC1 is a highvoltage P-channel MOS transistor (HV Pmos) while the second clamptransistor MC2 is a high voltage N-channel MOS transistor (HV Nmos).Moreover, the clamp diodes, DC1 and DC2, are high voltage diodes (HVdiode).

The clamping block 5 is also shown in FIG. 4, in the case of a clampingoperation to a ground voltage reference GND, e.g., during the receivingstep of the transmission channel 1. It is to be noted that the clampingto the ground voltage reference GND generally should be ensured alsowhen the load is mainly capacitive. In this case, the output terminal ofthe transmission channel should generally be brought back to this groundvalue after the transmission.

Furthermore, the clamping to the ground is generally desirable inapplications in which the high voltage wave form to be transmitted,besides oscillating between a positive value of high voltage and anegative value of high voltage, stays for determined periods of time atthe ground value. Also the anti-noise block 6 is indicated too, beingconnected between the first output terminal HVout and the connectionterminal Xdcr of the transmission channel 1.

FIG. 4 also shows the equivalent diodes, DMC1 and DMC2, of the clamptransistors, MC1 and MC2, respectively, the first and second clamp inputdrivers, DRC1 and DRC2, being connected between a first clamp supplyvoltage reference terminal and a second clamp supply voltage referenceterminal, higher VDD_P and lower VDD_M, respectively, and the groundGND, whereto also the clamp central node XCc is connected.

FIG. 1 shows a classical pulser half-bridge scheme typically employed inultrasound applications. In operation, this architecture brings the nodeXdcr to different voltage levels through two or more half-bridgesoperating between voltage levels, for example, HVP0, HVM0, HVP1, HVM1and PGND. In such a configuration, it is possible to obtain N-levels,two for each half-bridge. The CLAMP 5 facilitates returning to thetransducer voltage PGND, adding another layer. The transducer LOAD 8 isdriven in voltage across the on resistance of the DMOS (e.g., MB1, MB2,MB3, MB4). With this type of architecture it is possible to stimulatethe transducers with rectangular waveforms or stairway waveforms, asshown in FIG. 5.

BRIEF SUMMARY

Rectangular and stairway waveforms provide a good compromise betweensimplicity, power consumption and performance. Such waveforms, however,have a large spectrum, and the limited bandwidth of a typical transducermay result in significant power loss. Distortion may be introduced, forexample, by the second harmonic component, which may render suchwaveforms unsuitable for some applications. Transmission channels suchas that shown in FIG. 1 also employ a significant number of high-voltagepower supplies to drive a transducer with a multilevel signal. Inaddition, most of the circuitry needs to be capable of operating at highvoltage, which limits the ability to integrate the components into anintegrated circuit, and a high-voltage switch with an aggressiveperformance is typically used to protect the receiver which typicallyoperates at a low-voltage.

High-end applications may employ structures with high-voltage linearamplifiers or transformers, in order to generate analog waveforms. Theseapproaches facilitate transmitting most of the power on the firstharmonic at the expense of others (including the second), and facilitateavoiding interference between adjacent transducers. Moreover, it allowsto optimize the apodization among different TX channels better focusingthe TX wave. However, the use of multiple high-voltage linear amplifiersand/or transformers may introduce significant cost, power and spacerequirements, and usually require the substantial use of discretetopologies.

The use of high-voltage components also negatively impacts theperformance of the receiver circuits. High-voltage MOS components alsotypically have poor match characteristics, which can lead to mismatchbetween rising and falling edges.

In an embodiment, a device comprises: a current generator circuit,which, in operation, generates current-integrator drive currents; areceiver, which, in operation, amplifies transducer-echo signals; andcontrol circuitry, which, in operation, generates one or more controlsignals to control: generation of current-integrator drive currents bythe current generator circuit during transducer-driving periods; andreception of transducer-echo signals by the receiver duringecho-reception periods. In an embodiment, the device comprises: a firstswitch; and a second switch, wherein, the current generator circuitcomprises a first plurality of current generators and a second pluralityof current generators; the first switch is coupled between the firstplurality of current generators and an output of the current generatorcircuit; the second switch is coupled between the second plurality ofcurrent generators and the output of the current generator circuit; andthe control circuitry, in operation, generates one or more controlsignals to selectively close the first and second switches duringtransducer-driving periods. In an embodiment, the control circuitry, inoperation, generates one or more control signals to close only one ofthe first and second switches at a time. In an embodiment, the controlcircuitry, in operation, generates one or more control signals tocontrol magnitudes of current generated by the first and secondpluralities of current generators. In an embodiment, the controlcircuitry, in operation, generates one or more control signals tocontrol magnitudes and directions of current-integrator drive currentsgenerated by the current generator circuit. In an embodiment, the devicecomprises an integrated circuit including the current generator circuitand the control circuitry. In an embodiment, the integrated circuitincludes the receiver. In an embodiment, the device comprises a currentintegrator, which, in operation, integrates current-integrator drivecurrents generated by current generator circuit to generate transducerdrive signals. In an embodiment, the current integrator comprises ahigh-voltage amplifier and a first capacitor. In an embodiment, thereceiver comprises a second current integrator including a low-voltageamplifier and a second capacitor. In an embodiment, the controlcircuitry, in operation, receives and processes transducer-echo signalsamplified by the receiver. In an embodiment, the device comprises: areceiver switch, wherein in operation, the control circuitry generatesat least one control signal to open the receiver switch duringtransducer-driving periods and to close the receiver switch duringecho-reception periods.

In an embodiment, a system comprises: a transducer; and a transmissionchannel, which, in operation, is coupled to the transducer, thetransmission channel including: a current generator circuit, which, inoperation, generates current-integrator drive currents; a currentintegrator, which, in operation, integrates current-integrator drivecurrents generated by current generator circuit to generate transducerdrive signals; a receiver, which, in operation, amplifiestransducer-echo signals; and control circuitry, which, in operation,generates one or more control signals to control: generation ofcurrent-integrator drive currents by the current generator circuitduring transducer-driving periods; and reception of transducer-echosignals by the receiver during echo-reception periods. In an embodiment,the transmission channel comprises: a first current-generator switch; asecond current-generator switch; and a receiver switch, wherein, thecurrent generator circuit comprises at least one first current generatorand at least one second current generator; the first current-generatorswitch is coupled between the at least one first current generator andan input of the current integrator; the second current-generator switchis coupled between the at least one second current generator and theinput of the current integrator; the receiver switch is coupled betweenthe input of the current integrator and an input of the receiver; andthe control circuitry, in operation, generates one or more controlsignals to: selectively close the first and second current generatorswitches during transducer-driving periods; open the receiver switchduring transducer-driving periods; and close the receiver switch duringecho-reception periods. In an embodiment, the control circuitry, inoperation, generates one or more control signals to control magnitudesand directions of current-integrator drive currents generated by thecurrent generator circuit. In an embodiment, the current integratorcomprises a high-voltage amplifier and a first capacitor. In anembodiment, the receiver comprises a second current integrator includinga low-voltage amplifier and a second capacitor. In an embodiment, thesystem comprises: a system base, which, in operation, is coupled to thetransducer through the transmission channel. In an embodiment, thetransducer comprises a piezoceramic crystal and the transmissionchannel, in operation, transmits ultrasonic pulses to the transducerduring transducer-driving periods. In an embodiment, the systemcomprises an integrated circuit including the current generator circuit,the receiver and the control circuitry.

In an embodiment, a method comprises: isolating an echo-receiver from atransducer during a transducer-driving period; generating acurrent-integrator drive current during the transducer-driving period;integrating the current-integrator drive current to generate atransducer-drive signal during the transducer-driving period; andcoupling the echo-receiver to the transducer during a transducer-echoreception period following the transducer-driving period. In anembodiment, the generating the current-integrator drive currentcomprises controlling magnitudes and directions of current generated bya current generator circuit. In an embodiment, the controllingmagnitudes and directions of current generated by the current generatorcircuit comprises generating control signals to control first and secondcurrent-generator switches. In an embodiment, the method comprisesgenerating control signals to control a receiver switch coupled betweenthe current integrator and the echo-receiver.

In an embodiment, a non-transitory computer-readable medium's contentscause control circuitry to control a method, the method comprising:isolating an echo-receiver from a transducer during a transducer-drivingperiod; generating a current-integrator drive current during thetransducer-driving period; integrating the current-integrator drivecurrent to generate a transducer-drive signal during thetransducer-driving period; and coupling the echo-receiver to thetransducer during a transducer-echo reception period following thetransducer-driving period. In an embodiment, the generating thecurrent-integrator drive current comprises controlling magnitudes anddirections of current generated by a current generator circuit. In anembodiment, the method comprises generating control signals to control areceiver switch coupled between the current integrator and theecho-receiver.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In these drawings:

FIG. 1 schematically shows a transmission channel for ultrasoundapplications;

FIG. 2 schematically shows a first and a second ultrasound pulse used inan ultrasonic transducer;

FIG. 3A shows in greater detail a high voltage switch during a turn-onstep and being comprised within the transmission channel of FIG. 1;

FIG. 3B shows an equivalent circuit of the switch of FIG. 3A underturn-on conditions;

FIG. 4 shows in greater detail a block comprised within the transmissionchannel of FIG. 1;

FIG. 5 schematically shows a rectangular ultrasonic pulse and a stairwayultrasound pulse used in an ultrasonic transducer;

FIG. 6 schematically shows a transmission channel, for example forultrasound applications, according to an embodiment;

FIG. 7 shows an example waveform according to an embodiment;

FIG. 8 schematically shows a transmission channel, for example forultrasound applications, according to an embodiment;

FIG. 9 schematically show a transducer system, for example forultrasound applications, according to an embodiment.

DETAILED DESCRIPTION

In the following description, numerous specific details are given toprovide a thorough understanding of embodiments. The embodiments can bepracticed without one or more of the specific details, or with othermethods, components, materials, etc. In other instances, well-knownstructures, materials, or operations, such as, for example, integratedcircuits, operational amplifiers, capacitors, diodes, drivers, etc., arenot shown or described in detail to avoid obscuring aspects of theembodiments.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrases “in oneembodiment” “according to an embodiment” or “in an embodiment” andsimilar phrases in various places throughout this specification are notnecessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

The headings provided herein are for convenience only and do notinterpret the scope or meaning of the embodiments.

An embodiment of a system 100 is schematically shown in FIG. 6. Thesystem 100 comprises a controller 102, a current generator circuit 104,a high-voltage amplification stage 106, switches S1, S2, a load 110,such as a transducer, a data repository 112 and a display 114. Thecontroller 102, the current generator circuit 104, switches S1, S2, andthe high-voltage amplification stage 106 form a transmission channel 125to transmit drive signals to the load 110.

The controller 102 includes control circuitry which as illustratedcomprises one or more processors P, one or more memories M, discretecircuitry DC (such as logic gates, capacitors, resistors, etc.), and oneor more state machines SM. The controller 102 generates control signalsto control, for example, the current generator 104, the high voltageamplification stage 106, and the display 114. Embodiments of thecontroller 102 may comprise fewer components than illustrated, maycomprise more components than illustrated, and may employ componentsalone or in various combinations to perform the various functions of thecontroller 102. For example, instructions stored in the memory M may beexecuted by the processor P to perform a function of the controller 102,one or more state machines may be employed to generate control signalsto control switches S1, S2, etc., and various combinations thereof. Insome embodiments, the controller may receive data signals, such as anoutput signal from a receiver (see, e.g., low voltage amplificationstage 108 of FIG. 8), and generate data and/or control signals based onthe received data signals. For example, the controller 102 may generatecontrol signals to cause the display 114 to display images based on adata signal (e.g., an amplified echo signal received from a receiver),may generate data based on a data signal (e.g., an amplified echo signalreceived from a receiver) and control the storage of the generated datain the data repository 112, etc. In some embodiments, the controller 102may receive data or program files, or combinations thereof, from thedata repository 112 and generate control signals based on the receivedfiles.

The current generator circuit 104 as illustrated comprises a firstplurality of current generators 116 coupled together in parallel betweena first voltage node LV and a first terminal of the switch S1, and asecond plurality of current generators 118 coupled together in parallelbetween a second voltage node −LV/0 and a first terminal of the switchS2. The second terminals of the switches S1 and S2 are coupled to anoutput of the current generator circuit 104. The switches S1, S2 may below-voltage switches. The current generators 116, 118 may be low-voltagecurrent generators. In some embodiments, a pair of current generatorsmay be employed instead of the first and second pluralities of currentgenerators 116, 118.

In operation, the controller 102 generates control signals to controlthe switches S1, S2, for example to control the generation of a drivingcurrent to drive the high-voltage amplification stage 106 duringtransducer-driving periods. As discussed in more detail elsewhereherein, the high-voltage amplification stage 106, duringtransducer-driving periods, integrates the driving current to generate atransducer-driving signal.

In some embodiments, the controller 102 may in operation generatecontrol signals to control the current generated by the first and secondpluralities of current generators 116, 118. For example, the controller102 may selectively activate or deactivate current generators of thefirst and second pluralities of current generators 116, 118. Forexample, additional switches (not shown) may be controlled to turnindividual current generators on or off, control signals may be providedto control the amount of current provided by each of the plurality ofgenerators (e.g., controlling the amount of current using a currentmirror configuration, etc.). As illustrated, with switch S1 closed, thefirst plurality of current generators feed a current I to thehigh-voltage amplification stage 106.

In operation, the first voltage node LV of the current generator circuit104 may be coupled to a low voltage supply (e.g., ±2.5 volts, ±5 volts,±12 volts, etc.), and the second voltage node of the current generatorcircuit 104 may be coupled to a ground or a low voltage supply (e.g.,±2.5 volts, ±5 volts, ±12 volts, etc.). For example, the first voltagenode may be coupled to +5 volts DC, and the second voltage node may becoupled to −5 volts DC, the first voltage node may be coupled to +5volts DC, and the second voltage node may be coupled to ground, etc.

The high-voltage amplification stage 106 as illustrated comprises ahigh-voltage amplifier 120 and a first capacitor C1. The negative inputof the high-voltage amplifier 120 is coupled to the output of thecurrent generator circuit 104. The first capacitor C1 is coupled betweenan output of the high-voltage amplifier 120 and the negative input ofthe high-voltage amplifier 120. The positive input of the high-voltageamplifier 120 is coupled to a reference voltage, such as a ground. Theoutput of the high-voltage amplifier 120 is coupled to a transducer nodeXDCR, which in operation is coupled to the load 110, such as atransducer. In operation, the high-voltage amplifier 120 may be suppliedby a high-voltage supply (e.g., ±120 volts, ±240 volts, etc.) Forexample, a first supply node HV of the high-voltage amplifier may becoupled to +240 volts DC, and a second supply node −HV/0 may be coupledto −240 volts DC, the first supply node HV may be coupled to +240 voltsDC, and the second supply node −HV/0 may be coupled to ground, etc.

The load 110, in operation, is coupled to the transducer node XDCR. Theload 110 may comprise, for example, a transducer, such as apiezoelectric crystal that may be suitably biased for causing itsdeformation and the generation of the ultrasound signal or pulse.

The data repository 112 may comprise any suitable storage medium forstoring data, such as a hard disk, a RAM, etc. The data repository maystore, for example, instructions for loading into a memory M of thecontroller 102, which may be executed by a processor P of the controller102 to generate control signals, data generated based on a signal from areceiver, etc., and various combinations thereof.

The display 114 may comprise any known display for displaying imagesgenerated based on a transducer signal, such as ultrasonic images. Inoperation, the controller 102, a separate or integrated receiver (seelow voltage amplification stage 108 of FIG. 8), etc., and variouscombinations thereof, may generate signals to cause the display todisplay images.

In operation, switches S1 and S2 may be controlled to bring thetransducer node XDCR to a desired voltage as a function of time, limitedby the supply voltages of the high-voltage amplifier 120. Thehigh-voltage amplification stage 106 in operation functions as a currentintegrator, e.g., according to:XDCR=dV/dT=I/C1

An example of controlling the system 100 of FIG. 6 to produce a desiredvoltage wave form will be discussed with reference to the examplewaveform of FIG. 7. One of skill in the art will recognize that it isnot always possible in practice to achieve ideal results. The system 100may be controlled to produce other waveforms and in other manners toproduce the same waveform.

During a first time period T1, S1 is closed and S2 is open, and thefirst plurality of current generators 116 is controlled to produce acurrent of +4I (e.g., four of the first plurality of current generators116 are activated), causing a current of +4I to flow through thehigh-voltage amplification stage 106. This causes a voltage at the nodeXDCR to increase at a rate proportional to the current +4I.

During a second time period T2, S1 is closed and S2 is open, and thefirst plurality of current generators 116 is controlled to produce acurrent of +2I (e.g., two of the first plurality of current generators116 are activated), causing a current of +2I to flow through thehigh-voltage amplification stage 106. This causes the voltage at thenode XDCR to increase at a rate proportional to the current +2I.

During a third time period T3, S1 is closed and S2 is open, and thefirst plurality of current generators 116 is controlled to produce acurrent of +I (e.g., one of the first plurality of current generators116 is activated), causing a current of +I to flow through thehigh-voltage amplification stage 106. This causes the voltage at thenode XDCR to increase at a rate proportional to the current +I.

During a fourth time period T4, S1 is closed and S2 is open, and thefirst plurality of current generators 116 is controlled to produce acurrent of +I (e.g., one of the first plurality of current generators116 is activated), causing a current of +I to flow through thehigh-voltage amplification stage 106. However, the voltage at the nodeXDCR does not continue to increase, for example, because a limit imposedby the high-voltage amplifier 120 configuration has been reached.

During a fifth time period T5, S2 is closed and S1 is open, and thesecond plurality of current generators 118 are controlled to produce acurrent of −4I (e.g., four of the second plurality of current generators118 are activated), causing a current of −4I to flow through thehigh-voltage amplification stage 106. This causes the voltage at thenode XDCR to decrease at a rate proportional to the current −4I.

During a sixth time period T6, S2 is closed and S1 is open, and thesecond plurality of current generators 118 are controlled to produce acurrent of −2I (e.g., two of the second plurality of current generators118 are activated), causing a current of −2I to flow through thehigh-voltage amplification stage 106. This causes the voltage at thenode XDCR to decrease at a rate proportional to the current −2I.

During a seventh time period T7, S2 is closed and S1 is open, and thesecond plurality of current generators 118 are controlled to produce acurrent of −4I (e.g., four of the second plurality of current generators118 are activated), causing a current of −4I to flow through thehigh-voltage amplification stage 106. This causes the voltage at thenode XDCR to decrease at a rate proportional to the current −4I.

During an eighth time period T8, S2 is closed and S1 is open, and thesecond plurality of current generators are controlled to produce acurrent of −4I (e.g., four of the second plurality of current generators118 are activated), causing a current of −4I to flow through thehigh-voltage amplification stage 106. However, the voltage at the nodeXDCR does not continue to decrease, for example, because a limit imposedby the high-voltage amplifier 120 configuration has been reached.

In operation, when both S1 and S2 are open, no current is driven throughthe high-voltage amplification stage, and XDCR fails to zero. A signalreceived from the load 110 (e.g., an echo signal from a transducer)introduces a low-voltage signal at XDCR, which may be provided to areceiver (see low voltage amplification stage 108 of FIG. 8). It isnoted that, in operation, before C1 only low-voltages are needed, whichfacilitates the use of low-voltage components and the coupling of thesystem 100 to a receiver.

In an embodiment, the system 100 may include one or more integratedcircuits comprising the controller 102. In an embodiment, the one ormore integrated circuits may include all or part of one or more of thecurrent generator circuit 104, the high-voltage amplification stage 106,the data repository 112, the display 114, and the first, and second S1,S2. In an embodiment, the first capacitor C1 may be implemented usingdiscrete circuitry. In an embodiment, all or part of the high-voltageamplifier 120 may be implemented using discrete circuitry. In anembodiment, all or part of the system 100 may be integrated into atransducer probe including the load 110. In an embodiment, the load 110may comprise a piezoceramic crystal.

An embodiment of a system 200 is schematically shown in FIG. 8. Thesystem 200 comprises a controller 102, a current generator circuit 104,a high-voltage amplification stage 106, a low-voltage amplificationstage 108, switches S1, S2, S3, a load 110, such as a transducer, a datarepository 112 and a display 114. The controller 102, the currentgenerator circuit 104, switches S1, S2, S3, the high-voltageamplification stage 106 and the low-voltage amplification stage 108 forma transmission channel 125 to transmit drive signals to, and receiveecho signals from, the load 110.

The controller 102 includes control circuitry which as illustratedcomprises one or more processors P, one or more memories M, discretecircuitry DC (such as logic gates, capacitors, resistors, etc.), and oneor more state machines SM. The controller 102 generates control signalsto control, for example, the current generator 104, the high voltageamplification stage 106, the low voltage amplification stage 108, andthe display 114. Embodiments of the controller 102 may comprise fewercomponents than illustrated, may comprise more components thanillustrated, and may employ components alone or in various combinationsto perform the various functions of the controller 102. For example,instructions stored in the memory M may be executed by the processor Pto perform a function of the controller 102, one or more state machinesmay be employed to generate control signals to control switches S1, S2,S3, etc., and various combinations thereof. In some embodiments, thecontroller may receive data signals, such as an output signal from thelow voltage amplification stage 108, and generate data and/or controlsignals based on the received data signals. For example, the controller102 may generate control signals to cause the display 114 to displayimages based on a data signal (e.g., an amplified echo signal receivedfrom low voltage amplification stage 108), may generate data based on adata signal (e.g., an amplified echo signal received from low voltageamplification stage 108) and control the storage of the generated datain the data repository 112, etc. In some embodiments, the controller 102may receive data or program files, or combinations thereof, from thedata repository 112 and generate control signals based on the receivedfiles.

The current generator circuit 104 as illustrated comprises a firstplurality of current generators 116 coupled together in parallel betweena first voltage node LV and a first terminal of a first switch S1, and asecond plurality of current generators 118 coupled together in parallelbetween a second voltage node −LV/0 and a first terminal of a secondswitch S2. The second terminals of the first and second switches S1, S2are coupled together and provide an output of the current generatorcircuit 104. The first and second switches S1, S2 may be low-voltageswitches. The current generators 116, 118 may be low-voltage currentgenerators. In some embodiments, a pair of current generators may beemployed instead of the first and second pluralities of currentgenerators 116, 118.

In operation, the controller 102 generates control signals to controlthe switches S1, S2, S3, for example to control the generation of adriving current to drive the high-voltage amplification stage 106 duringtransducer-driving periods and to control coupling of the low-voltageamplification stage 108 to the transducer during reception periodsduring which an echo-signal may be received (e.g., betweentransducer-driving periods). As discussed in more detail elsewhereherein, the high-voltage amplification stage 106, duringtransducer-driving periods, integrates the driving current to generate atransducer-driving signal.

In some embodiments, the controller 102 may in operation generatecontrol signals to control the current generated by the first and secondpluralities of current generators 116, 118. For example, the controller102 may selectively activate or deactivate current generators of thefirst and second pluralities of current generators 116, 118. Forexample, additional switches (not shown) may be controlled to turnindividual current generators on or off, control signals may be providedto control the amount of current provided by each of the plurality ofgenerators (e.g., controlling the amount of current using a currentmirror configuration, etc.). As illustrated, with the first switch S1closed, and the second switch S2 and the third switch S3 open, the firstplurality of current generators 116 are controlled to feed a current Ito the high-voltage amplification stage 106.

In operation, the first voltage node LV of the current generator circuit104 may be coupled to a low voltage supply (e.g., ±2.5 volts, ±5 volts,±12 volts, etc.), and the second voltage node of the current generatorcircuit 104 may be coupled to a ground or a low voltage supply (e.g.,±2.5 volts, ±5 volts, ±12 volts, etc.). For example, the first voltagenode may be coupled to +5 volts DC, and the second voltage node may becoupled to −5 volts DC, the first voltage node may be coupled to +5volts DC, and the second voltage node may be coupled to ground, etc.

The high-voltage amplification stage 106 as illustrated comprises ahigh-voltage amplifier 120 and a first capacitor C1. The negative inputof the high-voltage amplifier 120 is coupled to the output of thecurrent generator circuit 104 and to a first terminal of the thirdswitch S3. The first capacitor C1 is coupled between an output of thehigh-voltage amplifier 120 and the negative input of the high-voltageamplifier 120. The positive input of the high-voltage amplifier 120 iscoupled to a reference voltage, such as a ground. The output of thehigh-voltage amplifier 120 is coupled to a transducer node XDCR, whichin operation is coupled to the load 110, such as a transducer. Inoperation, the high-voltage amplifier 120 may be supplied byhigh-voltage supply (e.g., ±120 volts, ±240 volts, etc.) For example, afirst supply node HV of the high-voltage amplifier may be coupled to+240 volts DC, and a second supply node −HV/0 may be coupled to −240volts DC, the first supply node HV may be coupled to +240 volts DC, andthe second supply node −HV/0 may be coupled to ground, etc.

The low-voltage amplification stage 108 as illustrated comprises alow-voltage amplifier 122 and a second capacitor C2. The negative inputof the low-voltage amplifier 122 is coupled to the second terminal ofthe switch S3. The second capacitor C2 is coupled between an output ofthe low-voltage amplifier 122 and the negative input of the low-voltageamplifier 122. The positive input of the low-voltage amplifier 122 iscoupled to the reference voltage. The output of the low-voltageamplifier 122 is coupled to a low-voltage output node LVOUT, which inoperation may be coupled to another receiver (not shown), to thecontroller 102, etc., and various combinations thereof, to facilitateprocessing of an echo signal received at the transducer node XDCR andamplified by the low-voltage amplification stage 108. In operation, thelow-voltage amplifier 122 may be supplied by low-voltage supply (e.g.,±2.5 volts, ±5 volts, ±12 volts, etc.) For example, a first supply nodeLV of the low-voltage amplifier 122 may be coupled to +5 volts DC, and asecond supply node −LV/0 may be coupled to −5 volts DC, the first supplynode LV may be coupled to +5 volts DC, and the second supply node −LV/0may be coupled to ground, etc. The low-voltage amplification stage, inoperation, receives and amplifies transducer-echo signals.

The load 110, in operation, is coupled to the transducer node XDCR. Theload 110 may comprise, for example, a transducer, such as apiezoelectric crystal that may be suitably biased for causing itsdeformation and the generation of the ultrasound signal or pulse.

The data repository 112 may comprise any suitable storage medium forstoring data, such as a hard disk, a RAM, etc. The data repository maystore, for example, instructions for loading into a memory M of thecontroller 102, which may be executed by a processor P of the controller102, data generated based on a signal at the low-voltage output nodeLVOUT, etc., and various combinations thereof.

The display 114 may comprise any known display for displaying imagesgenerated based on a transducer signal, such as ultrasonic images. Inoperation, the controller 102, a separate or integrated receiver (seelow voltage amplification stage 108 of FIG. 8), etc., and variouscombinations thereof, may generate signals to cause the display todisplay images.

In operation, switch S3 is opened during transducer-driving periods toisolate the low-voltage amplification stage 108 from the high-voltageamplification stage 106. In operation, when switch S3 is open, switchesS1 and S2 may be controlled to bring the transducer node XDCR to adesired voltage as a function of time, limited by characteristics of thehigh-voltage amplification stage 106, such as the supply voltages of thehigh-voltage amplifier 120. The high-voltage amplification stage 106 inoperation functions as a current integrator, e.g. according to:XDCR=dV/dT=I/C1

An example of controlling the system 200 of FIG. 8 to produce a desiredvoltage wave form will be discussed with reference to the examplewaveform of FIG. 7. One of skill in the art will recognize that it isnot always possible in practice to achieve ideal results. The system 200may be controlled to produce other waveforms and in other manners toproduce the same waveform.

During a first time period T1, the first switch S1 is closed and thesecond and third switches S2, S3 are open, and the first plurality ofcurrent generators 116 are controlled to produce a current of +4I (e.g.,four of the first plurality of current generators 116 are activated),causing a current of +4I to flow through the high-voltage amplificationstage 106. This causes a voltage at the node XDCR to increase at a rateproportional to the current +4I.

During a second time period T2, the first switch S1 is closed and thesecond and third switches S2, S3 are open, and the first plurality ofcurrent generators 116 are controlled to produce a current of +2I (e.g.,two of the first plurality of current generators 116 are activated),causing a current of +2I to flow through the high-voltage amplificationstage 106. This causes the voltage at the node XDCR to increase at arate proportional to the current +2I.

During a third time period T3, the first switch S1 is closed and thesecond and third switches S2, S3 are open, and the first plurality ofcurrent generators 116 are controlled to produce a current of +I (e.g.,one of the first plurality of current generators 116 is activated),causing a current of +I to flow through the high-voltage amplificationstage 106. This causes the voltage at the node XDCR to increase at arate proportional to the current +I.

During a fourth time period T4, the first switch S1 is closed and thesecond and third switches S2, S3 are open, and the first plurality ofcurrent generators 116 are controlled to produce a current of +1I (e.g.,one of the first plurality of current generators 116 is activated),causing a current of +I to flow through the high-voltage amplificationstage 106. However, the voltage at the node XDCR does not continue toincrease, for example, because a limit imposed by the high-voltageamplifier 120 configuration has been reached.

During a fifth time period T5, the second switch S2 is closed and thefirst and third switches S1, S3 are open, and the second plurality ofcurrent generators 118 are controlled to produce a current of −4I (e.g.,four of the second plurality of current generators 118 are activated),causing a current of −4I to flow through the high-voltage amplificationstage 106. This causes the voltage at the node XDCR to decrease at arate proportional to the current −4I.

During a sixth time period T6, the second switch S2 is closed and thefirst and third switches S1, S3 are open, and the second plurality ofcurrent generators 118 are controlled to produce a current of −2I (e.g.,two of the second plurality of current generators 118 are activated),causing a current of −2I to flow through the high-voltage amplificationstage 106. This causes the voltage at the node XDCR to decrease at arate proportional to the current −2I.

During a seventh time period T7, the second switch S2 is closed and thefirst and third switches S1, S3 are open, and the second plurality ofcurrent generators 118 are controlled to produce a current of −4I (e.g.,four of the second plurality of current generators 118 are activated),causing a current of −4I to flow through the high-voltage amplificationstage 106. This causes the voltage at the node XDCR to decrease at arate proportional to the current −4I.

During an eighth time period T8, the second switch S2 is closed and thefirst and third switches S1, S3 are open, and the second plurality ofcurrent generators 118 are controlled to produce a current of −4I (e.g.,four of the second plurality of current generators 118 are activated),causing a current of −4I to flow through the high-voltage amplificationstage 106. However, the voltage at the node XDCR does not continue todecrease, for example, because a limit imposed by the high-voltageamplifier 120 configuration has been reached.

In operation, the third switch S3 is closed and the first and secondswitches are opened during reception periods, such as when anecho-signal may be received from a transducer. In operation, during areception period the third switch S3 is closed, the first and secondswitches S1, S2 are open, and no current is driven through thehigh-voltage amplification stage 106 by the current generator circuit104, and XDCR fails to zero. A signal received from the load 110 (e.g.,an echo signal from a transducer) may introduce a low-voltage signal atXDCR, which is amplified by the low voltage amplification stage 108according to, for example:LVOUT=XDCR*C1/C2

The first capacitor C1 in operation functions as part of thehigh-voltage amplification stage 106 when the high-voltage amplificationstage is being driven by the current generator circuit 104, andfunctions as part of the low-voltage amplification stage 108 when anecho signal is received.

In an embodiment, the system 200 may include one or more integratedcircuits comprising the controller 102. In an embodiment, the one ormore integrated circuits may include all or part of one or more of thecurrent generator circuit 104, the high-voltage amplification stage 106,the low-voltage amplification stage 108, the data repository 112, thedisplay 114, and the first, second and third switches S1, S2, S3. In anembodiment, the first capacitor C1 may be implemented using discretecircuitry. In an embodiment, the second capacitor C2 may be implementedusing discrete circuitry. In an embodiment, all or part of thehigh-voltage amplifier 120 may be implemented using discrete circuitry.In an embodiment, all or part of the system 200 may be integrated into atransducer probe including the load 110. In an embodiment, the load 110may comprise a piezoceramic crystal.

Other switching configurations may be employed in various embodiments,and one of skill in the art will appreciate how to control such switchesto produce desired waveforms after reviewing the discussion herein. Forexample, an additional switch (not shown) may be coupled between thesecond terminals of the first and second switches and the output of thecurrent generator circuit 104. One of skill in the art will appreciatethat such an additional switch may be closed in operation when thecurrent generator circuit 104 is driving the high-voltage amplificationstage 106, and open in operation to isolate the low-voltageamplification stage 108 from the current generator circuit 104.

One or more embodiments may facilitate the use of low-voltage componentsin all of the stages except the high voltage amplification stage,implementing the system using mostly integrated circuitry, simplifyingthe circuitry, generating signals with different shapes, eliminatinghigh voltage switches (see switch 7 of FIG. 1) and clamps (see clamp 5of FIG. 1), and reducing noise (capacitors are relatively noiselesscompared to high voltage switches with high on-resistance). In anembodiment, the high-voltage components are used only to provide currentto the load, which may reduce or eliminate concerns about matching thecharacteristics of the high-voltage components, and facilitate obtaininga high match between rising and failing edges of the signal provided tothe load. An embodiment may facilitate controlling the power consumptionusing the control signals (e.g., by controlling the driving currentprovided to the high-voltage amplification stage). An embodiment mayfacilitate providing a capacitive isolation between the high-voltage andlow-voltage domains of a transmission channel.

FIG. 9 illustrates an embodiment of a system 300, which, for example,may implement an embodiment of the system 200 of FIG. 8. The systemcomprises a probe 302 and a system base 304 coupled together through abus system 306. The probe 302 includes an integrated circuit 130, ahigh-voltage amplification stage 106 and a load 110. In someembodiments, the probe 302 may include all or part of the bus system306. The integrated circuit 130 includes a controller 102, a currentgenerator circuit 104, a low voltage amplification stage 108 andswitches S1, S2, S3. The system base 304 includes processing circuitry,such as one or more processors, one or more memories, discretecircuitry, state machines, etc., a data repository 112 and a display114. Some embodiments may not include all of the components illustratedin FIG. 9, may include additional components not shown in FIG. 9, maydistribute components in a manner different than as shown in FIG. 9, andvarious combination thereof.

Some embodiments may take the form of computer program products. Forexample, according to one embodiment there is provided a computerreadable medium comprising a computer program adapted to perform one ormore of the methods described above. The medium may be a physicalstorage medium such as for example a Read Only Memory (ROM) chip, or adisk such as a Digital Versatile Disk (DVD-ROM), Compact Disk (CD-ROM),a hard disk, a memory, a network, or a portable media article to be readby an appropriate drive or via an appropriate connection, including asencoded in one or more barcodes or other related codes stored on one ormore such computer-readable mediums and being readable by an appropriatereader device.

Furthermore, in some embodiments, some or all of the systems and/ormodules may be implemented or provided in other manners, such as atleast partially in firmware and/or hardware, including, but not limitedto, one or more application-specific integrated circuits (ASICs),discrete circuitry, standard integrated circuits, controllers (e.g., byexecuting appropriate instructions, and including microcontrollersand/or embedded controllers), field-programmable gate arrays (FPGAs),complex programmable logic devices (CPLDs), etc., as well as devicesthat employ RFID technology. In some embodiments, some of the modules orcontrollers separately described herein may be combined, split intofurther modules and/or split and recombined in various manners.

The various embodiments described above can be combined to providefurther embodiments. These and other changes can be made to theembodiments in light of the above-detailed description. In general, inthe following claims, the terms used should not be construed to limitthe claims to the specific embodiments disclosed in the specificationand the claims, but should be construed to include all possibleembodiments along with the full scope of equivalents to which suchclaims are entitled. Accordingly, the claims are not limited by thedisclosure.

The invention claimed is:
 1. A device, comprising: a current generatorcircuit, which, in operation, generates current-integrator drivecurrents; a receiver, which, in operation, amplifies transducer-echosignals; and control circuitry, which, in operation, generates one ormore control signals to control: generation of current-integrator drivecurrents by the current generator circuit during transducer-drivingperiods; and reception of transducer-echo signals by the receiver duringecho-reception periods.
 2. The device of claim 1, comprising: a firstswitch; and a second switch, wherein, the current generator circuitcomprises a first plurality of current generators and a second pluralityof current generators; the first switch is coupled between the firstplurality of current generators and an output of the current generatorcircuit; the second switch is coupled between the second plurality ofcurrent generators and the output of the current generator circuit; andthe control circuitry, in operation, generates one or more controlsignals to selectively close the first and second switches duringtransducer-driving periods.
 3. The device of claim 2 wherein the controlcircuitry, in operation, generates one or more control signals to closeonly one of the first and second switches at a time.
 4. The device ofclaim 2 wherein the control circuitry, in operation, generates one ormore control signals to control magnitudes of current generated by thefirst and second pluralities of current generators.
 5. The device ofclaim 1 wherein the control circuitry, in operation, generates one ormore control signals to control magnitudes and directions ofcurrent-integrator drive currents generated by the current generatorcircuit.
 6. The device of claim 5, comprising: an integrated circuitincluding the current generator circuit and the control circuitry. 7.The device of claim 6 wherein the integrated circuit includes thereceiver.
 8. The device of claim 5, comprising: a current integrator,which, in operation, integrates current-integrator drive currentsgenerated by current generator circuit to generate transducer drivesignals.
 9. The device of claim 8 wherein the current integratorcomprises a high-voltage amplifier and a first capacitor.
 10. The deviceof claim 9 wherein the receiver comprises a second current integratorincluding a low-voltage amplifier and a second capacitor.
 11. The deviceof claim 10 wherein the control circuitry, in operation, receives andprocesses transducer-echo signals amplified by the receiver.
 12. Thedevice of claim 1, comprising: a receiver switch, wherein in operation,the control circuitry generates at least one control signal to open thereceiver switch during transducer-driving periods and to close thereceiver switch during echo-reception periods.
 13. A system, comprising:a transducer; and a transmission channel, which, in operation, iscoupled to the transducer, the transmission channel including: a currentgenerator circuit, which, in operation, generates current-integratordrive currents; a current integrator, which, in operation, integratescurrent-integrator drive currents generated by current generator circuitto generate transducer drive signals; a receiver, which, in operation,amplifies transducer-echo signals; and control circuitry, which, inoperation, generates one or more control signals to control: generationof current-integrator drive currents by the current generator circuitduring transducer-driving periods; and reception of transducer-echosignals by the receiver during echo-reception periods.
 14. The system ofclaim 13 wherein the transmission channel comprises: a firstcurrent-generator switch; a second current-generator switch; and areceiver switch, wherein, the current generator circuit comprises atleast one first current generator and at least one second currentgenerator; the first current-generator switch is coupled between the atleast one first current generator and an input of the currentintegrator; the second current-generator switch is coupled between theat least one second current generator and the input of the currentintegrator; the receiver switch is coupled between the input of thecurrent integrator and an input of the receiver; and the controlcircuitry, in operation, generates one or more control signals to:selectively close the first and second current generator switches duringtransducer-driving periods; open the receiver switch duringtransducer-driving periods; and close the receiver switch duringecho-reception periods.
 15. The system of claim 13 wherein the controlcircuitry, in operation, generates one or more control signals tocontrol magnitudes and directions of current-integrator drive currentsgenerated by the current generator circuit.
 16. The system of claim 15wherein the current integrator comprises a high-voltage amplifier and afirst capacitor.
 17. The system of claim 16 wherein the receivercomprises a second current integrator including a low-voltage amplifierand a second capacitor.
 18. The system of claim 17, comprising: a systembase, which, in operation, is coupled to the transducer through thetransmission channel.
 19. The system of claim 13 wherein the transducercomprises a piezoceramic crystal and the transmission channel, inoperation, transmits ultrasonic pulses to the transducer duringtransducer-driving periods.
 20. The system of claim 13, comprising anintegrated circuit including the current generator circuit, the receiverand the control circuitry.
 21. A method, comprising: isolating anecho-receiver from a transducer during a transducer-driving period;generating a current-integrator drive current during thetransducer-driving period; integrating the current-integrator drivecurrent to generate a transducer-drive signal during thetransducer-driving period; and coupling the echo-receiver to thetransducer during a transducer-echo reception period following thetransducer-driving period.
 22. The method of claim 21 wherein thegenerating the current-integrator drive current comprises controllingmagnitudes and directions of current generated by a current generatorcircuit.
 23. The method of claim 22 wherein, the controlling magnitudesand directions of current generated by the current generator circuitcomprises generating control signals to control first and secondcurrent-generator switches.
 24. The method of claim 23, comprisinggenerating control signals to control a receiver switch coupled betweenthe current integrator and the echo-receiver.
 25. A non-transitorycomputer-readable medium whose contents cause control circuitry tocontrol a method, the method comprising: isolating an echo-receiver froma transducer during a transducer-driving period; generating acurrent-integrator drive current during the transducer-driving period;integrating the current-integrator drive current to generate atransducer-drive signal during the transducer-driving period; andcoupling the echo-receiver to the transducer during a transducer-echoreception period following the transducer-driving period.
 26. The mediumof claim 25 wherein the generating the current-integrator drive currentcomprises controlling magnitudes and directions of current generated bya current generator circuit.
 27. The medium of claim 26 wherein themethod comprises generating control signals to control a receiver switchcoupled between the current integrator and the echo-receiver.